eksoteriki_thermomonosi

Splash Zone of External Thermal Insulation Composite Systems (ETICS)

Problem

The appearance of moisture in the masonry can be caused either from groundwater or from surface water and can create in our building significant problems such as cracks, white crystalline spots, stains or even oxidation in the structural elements of the construction. Before installing the MONOSIS external thermal insulation system of MARMOLINE, we must take care of this with the appropriate materials.

Solution

The substrate must be stable and free of loose, dust and oils and structurally even without cracks in order to proceed with the application of the materials. If there are points on the substrate that need repair, they must be repaired before with suitable MARMOLINE repair materials. Then a Splash Zone of External Thermal Insulation Composite Systems should be created around the construction at a height of about 50 cm above ground level.

Application steps

Application of waterproofing mortar

For the waterproofing of the external thermal insulation system of MARMOLINE, the flexible, 2-component, polymer-modified, waterproofing cement-based slurry AQUATA ELASTIC of MARMOLINE is used at a height of about 50 cm from the ground level. It consists of two components, which are a cement-based powder mortar (component A) and an emulsion resin (component B).

Prior to application of MARMOLINE AQUATA ELASTIC, it is recommended to wet the substrate to saturation and to remove any ponding water. Slowly empty component A (25 kg dry mortar bag) into a container filled with component B (liquid part 8.75 kg) while mixing with a suitable mixer. The material should be mixed at slow speeds until the material is homogeneous and free of lumps. Allow the mixture to stand for 3 minutes and mix again, adding the remaining liquid. Caution! It is not allowed to add water to the mixture.

Apply the product with a hard brush in two or more layers crosswise (the desired thickness per layer is 1 mm).

TIPS

Do not apply AQUATA ELASTIC on icy substrates, frost or at high temperatures (substrate temperature above +250 C).

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